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Plot 16, Bayan Lepas Technoplex, Industrial Zone Phase 4, 11900 Bayan Lepas, Penang, Malaysia.
Designed with high speed rotary concept which pick ICs directly from trays, vision inspection and electrical test before output into tape/reel with auto replace capability.
| Description | |
|---|---|
| Input | Jedec Tray, Waffle Tray |
| Output | Tape & Reel with auto replace, Waffle tray |
| Vision Systems | 2D, 3D, 5S, bottom pads, 6 sided, In-pocket. Micro-crack capable. Colour and mono camera. BGA Balls. |
| No. of Test Site | Up to 16 sites |
| Test Force (selectable) | 0.3kg - 3kg, Extraforce available up to 9kg. Real time test force display. |
| Applicable Packages | WLCSP, QFN, QFP, BGA, SOIC & etc |
| UPH | Up to 30k depends on package type |
| Test Socket & Contactors | Kelvin Contact, Clamp Type, Flat Test (100 Ampere @ 1ms) |
| Handler-Tester Comm. | GPIB, TTL, RS232 |
| Networking | SECS GEM |