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      Products & Solutions

      KGD Handler Patented : Malaysia (MY-209314-A) ; Taiwan (I916288)

      High speed and flexible SiC die test handler

      Specifications
      Machine ModelPower R01
      Input4" Waffle Pack, Detaper, 6", 8" & 12" Wafer Ring
      Output4" Waffle Pack, Tape & Reel, 6", 8" & 12" Wafer Reconstruct
      Test Features2 Meter Length Spacing Available Support Soft Or Hard Docking Requirement
      Applicable PackagesKGD Up To 12x16mm Die Size
      UPH4K with 0.4s Test-Time, Serial Test
      Vision Systems (Optional)6 Sided AOi Color Vision System
      Size1965 x 3620 x 2060mm (LxWxH) (without test site)
      UtilityPower Supply : 3-phase 415VAC, Air supply : minimum 5 bar/70PSI, 300-500L/Min