| Input: |
Jedec Tray, Waffle Tray |
| Output: |
Tape & Reel with auto replace, Waffle tray |
| Vision Systems: |
2D, 3D, 5S, bottom pads, 6 sided, In-pocket. Micro-crack capable. Colour and mono camera. BGA Balls. |
| No. of Test Site: |
Up to 16 sites |
| Test Force (selectable): |
0.3kg - 3kg, Extraforce available up to 9kg. Real time test force display. |
| Applicable Packages: |
WLCSP, QFN, QFP, BGA, SOIC & etc |
| UPH: |
Up to 30k depends on package type |
| Test Socket & Contactors: |
Kelvin Contact, Clamp Type, Flat Test (100 Ampere @ 1ms) |
| Handler-Tester Comm.: |
GPIB, TTL, RS232 |
| Networking: |
SECS GEM, TCPIP |
